Future of Engineering

Stacked package is a promising solution offering high integration that leads to miniaturization. Among stacked packages, package-in-package (PiP) and package-on-package (PoP) are increasingly becoming important in the packaging industry, especially in mobile phone applications, as they enable the stacking of high-density logic devices. PoP solutions feature two packages with one placed above the other; solder balls are used to bond both these packages. This type of packaging results in the integration of logic and memory components in separate packages. For example, the integration of the application processor and the memory in mobile phones is achieved by using PoP solutions.PoP solutions contain two to four memory dies stacked on the top-package and one or two logic devices stacked on the bottom-package. The package height for the PoP solution depends on the number of dies encapsulated within that package. Presently, mobile handsets and digital cameras are stacking two packages for logic and memory architecture, while flash memory modules and high-density dynamic random access memory (DRAM) are stacking up to four packages more.

Full report from here

Labels: Industrial-Engineering