Future of Engineering
Friday, February 22, 2008
GaAs, GaN, SiGe, InP - RF Semiconductors Take Various Forms
As wireless technologies push semiconductors to integrate more features in smaller packages, government and satellite research is testing novel processes in extreme temperatures and performance scenarios.
At the roots of almost all of today’s electronic devices lie semiconductors. These integrated circuits (ICs) stem from a variety of semiconductor technologies, which have evolved to satisfy requirements like lower power, less noise, more broadband coverage, or simply the need to squeeze higher integration into smaller, cheaper packages. In reaction to these trends, high-frequency engineers have found new ways to leverage gallium arsenide (GaAs), gallium nitride (GaN), silicon germanium (SiGe), indium phosphide (InP), and other semiconductor process technologies. As these technologies have evolved, however, they have not eliminated the more standard technologies like complementary-metaloxide- semiconductor (CMOS) processes. Instead, process enhancements and advances in optolithography are enabling smaller feature sizes and making CMOS and other technologies capable of tackling new and more demanding applications. The result is a myriad of semiconductors that can serve all aspects of the high-frequency market ranging from the most demanding military and satellite applications to access points for IEEE 802.11x wireless local-area networks (WLANs).
More from here
At the roots of almost all of today’s electronic devices lie semiconductors. These integrated circuits (ICs) stem from a variety of semiconductor technologies, which have evolved to satisfy requirements like lower power, less noise, more broadband coverage, or simply the need to squeeze higher integration into smaller, cheaper packages. In reaction to these trends, high-frequency engineers have found new ways to leverage gallium arsenide (GaAs), gallium nitride (GaN), silicon germanium (SiGe), indium phosphide (InP), and other semiconductor process technologies. As these technologies have evolved, however, they have not eliminated the more standard technologies like complementary-metaloxide- semiconductor (CMOS) processes. Instead, process enhancements and advances in optolithography are enabling smaller feature sizes and making CMOS and other technologies capable of tackling new and more demanding applications. The result is a myriad of semiconductors that can serve all aspects of the high-frequency market ranging from the most demanding military and satellite applications to access points for IEEE 802.11x wireless local-area networks (WLANs).
More from here
Labels: Electronics-Communications-Engineering
